ITO sputtering target
View Patent ↗Provided are an ITO sputtering target wherein the number of particles having a grain diameter of 100 nm or greater exposed in the ITO sputtering target as a result of royal water etching or sputter etching is 1 particle/μm 2 , and an ITO sputtering target having a density of 7.12 g/cm 3 or greater capable of improving the sputtering performance, in particular inhibiting the generation of arcing, suppressing the generation of defects in the ITO film caused by such arcing, and thereby effectively inhibiting the deterioration of the ITO film.
1. An ITO sputtering target having a density of 7.12g/cm 3 or greater and wherein the number of particles having a diameter of 100 nm or greater and being exposed on a surface of the ITO sputtering target by royal water etching or sputter etching is 1 particle/μm 2 or less and wherein particles having a diameter of 1 μm or greater do not exist on the etched surface of the target.
2. The ITO sputtering target according to claim 1 , wherein the number of particles having a diameter of 100 nm or greater and being exposed on the surface of the ITO sputtering target by royal water etching or sputter etching is 0.02 particle/μm 2 or less.
3. An ITO sputtering target according to claim 1 , wherein said etched surface of said ITO sputtering target has a crystalline structure with minute grains, and wherein said particles are minute particles that are located within the minute grains, that have slower etching speed relative to adjacent areas of the surface of the target, and that form inner granular microstructures on said etched surface of said minute grains due to said slow etching speed.
4. An ITO sputtering target according to claim 3 , wherein said minute particles have higher tin content relative to adjacent areas of the surface of the target.
5. An ITO sputtering target having a density of 7.12 g/cm 3 or greater and wherein the number of particles having a diameter of 100 nm or greater and being exposed on a surface of the ITO sputtering target by royal water etching or sputter etching is 0.2 particle/μm 2 or less and wherein particles having a diameter of 1 μm or greater do not exist on the etched surface of the target.
6. An ITO sputtering target according to claim 5 , wherein said etched surface of said ITO sputtering target has a crystalline structure with minute grains, and wherein said particles are minute particles that are located within the minute grains, that have slower etching speed relative to adjacent areas of the surface of the target, and that form inner granular microstructures on said etched surface of said minute grains due to said slow etching speed.
7. An ITO sputtering target according to claim 6 , wherein said minute particles having slow etching speed have higher tin content relative to adjacent areas of the surface of the target.
8. An ITO sputtering target having a density of 7.12 g/cm 3 or greater and wherein said ITO sputtering target has no particle having a diameter of 100 nm or greater exposed on a surface of the ITO sputtering target by royal water etching or sputter etching.
9. An ITO sputtering target according to claim 8 , wherein the etched surface of said ITO sputtering target has a crystalline structure with minute grains, and wherein said particle not present on the etched surface is one that has a diameter of 100 nm or greater, that is located on the etched surface within one of the minute grains, that has slower etching speed relative to adjacent areas of the surface of the target, and that forms inner granular microstructures on said etched surface.
10. An ITO sputtering target having a density of 7.12 g/cm 3 or greater and wherein said ITO sputtering target has no particle having a grain diameter of 10 nm or greater exposed on a surface of the ITO sputtering target by royal water etching or sputter etching.
11. An ITO sputtering target according to claim 10 , wherein the etched surface of said ITO sputtering target has a crystalline structure with minute grains, and wherein said particle not present on the etched surface is one that has a diameter of 10 nm or greater, that is located on the etched surface within one of the minute grains, that has slower etching speed relative to adjacent areas of the surface of the target, and that forms inner granular microstructures on said etched surface.