Method for connecting magnetic substance target to backing plate, and magnetic substance target
View Patent ↗A method for connecting a magnetic substance target to a backing plate with less variation in plate thickness, characterized in having the steps of connecting the magnetic substance target to an aluminum plate beforehand while maintaining the flatness, connecting the magnetic substance target connected to the aluminum plate to the backing plate while maintaining the flatness, and grinding out the aluminum plate, whereby the flatness of the magnetic substance target can be maintained until the magnetic substance target is connected to the backing plate by a relatively simple operation.
1. A method for connecting a magnetic substance target with less variation in plate thickness to a backing plate, comprising the steps of: connecting the magnetic substance target to an aluminum plate while maintaining flatness of the magnetic substance target; after connecting the magnetic substance target to the aluminum plate, connecting the magnetic substance target connected to the aluminum plate to the backing plate while maintaining the flatness of the magnetic substance target; and grinding out the aluminum plate after said step of connecting the magnetic substance target to the backing plate.
2. A method for connecting a magnetic substance target to a backing plate according to claim 1 , wherein the magnetic substance target is iron, cobalt, nickel, platinum or the alloys thereof.
3. A method according to claim 2 , wherein the backing plate is made of copper, a copper alloy, aluminum or an aluminum alloy.
4. A method according to claim 3 , wherein the magnetic substance target and backing plate are connected via bonding or diffusion bonding.
5. A method according to claim 4 , wherein diffusion bonding is performed via an insert material made of an aluminum plate or an aluminum alloy plate.
6. A method according claim 5 , wherein, after grinding out the aluminum plate, the magnetic substance surface is further ground.
7. A method according to claim 1 , wherein the backing plate is made of copper, a copper alloy, aluminum or an aluminum alloy.
8. A method according to claim 1 , wherein the magnetic substance target and backing plate are connected via bonding or diffusion bonding.
9. A method according to claim 8 , wherein diffusion bonding is performed via an insert material made of an aluminum plate or an aluminum alloy plate.
10. A method according claim 1 , wherein, after grinding out the aluminum plate, the magnetic substance surface is further ground.
11. A method of assembling a magnetic substance target to a backing plate, comprising the steps of:
in a first connection step, bonding the magnetic substance target to an aluminum plate to maintain the magnetic substance target in a flat condition;
in a second connection step after said first connection step, bonding the magnetic substance target to the backing plate while maintaining the magnetic substance target in the flat condition with the aluminum plate; and
after said first and second connection steps, removing the aluminum plate from the magnetic substance target by grinding away the aluminum plate from the magnetic substance target.
12. A method according to claim 11 , wherein the backing plate is made of copper or a copper alloy.
13. A method according to claim 11 , wherein the backing plate is made of aluminum or an aluminum alloy.
14. A method according to claim 11 , wherein said second connection step is a diffusion bonding step and is performed using an insert material made of an aluminum plate or an aluminum alloy plate.
15. A method according to claim 11 , wherein the magnetic substance target is made of iron, cobalt, nickel, platinum or alloys thereof.