Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device

1. A carrier-attached copper foil having a carrier, an intermediate layer and an ultra-thin copper layer having a thickness of 0.1 and 12 μm in this order,

wherein a number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in a through-thickness direction is 0.1 to 5 grains/μm 2 , and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.

2. The carrier-attached copper foil according to claim 1 , wherein the ten point average roughness Rz of the surface on the side of the ultra-thin copper layer is 0.11 to 1.9 μm.

3. The carrier-attached copper foil according to claim 2 , wherein the ten point average roughness Rz of the surface on the side of the ultra-thin copper layer is 0.12 to 1.8 μm.

4. The carrier-attached copper foil according to claim 1 , wherein the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.2 to 4.8 grains/μm 2 .

5. The carrier-attached copper foil according to claim 4 , wherein the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.3 to 4.5 grains/μm 2 .

6. The carrier-attached copper foil according to claim 1 , wherein the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.1-1.15 grains/μm 2 .

7. The carrier-attached copper foil according to claim 1 , wherein the average grain size of crystal grains that form the ultra-thin copper layer is 0.5 to 6.0 μm in the cross section taken in the direction parallel to the through-thickness direction of the ultra-thin copper layer.

8. The carrier-attached copper foil according to claim 7 , wherein the average grain size of crystal grains that form the ultra-thin copper layer is 0.6 to 5.8 μm in the cross section taken in the direction parallel to the through-thickness direction of the ultra-thin copper layer.

9. The carrier-attached copper foil according to claim 8 , wherein the average grain size of crystal grains that form the ultra-thin copper layer is 0.7 to 5.6 μm in the cross section taken in the direction parallel to the through-thickness direction of the ultra-thin copper layer.

10. The carrier-attached copper foil according to claim 9 , wherein the average grain size of crystal grains that form the ultra-thin copper layer is 1.0 to 5.6 μm in the cross section taken in the direction parallel to the through-thickness direction of the ultra-thin copper layer.

11. The carrier-attached copper foil according to claim 1 , wherein the carrier-attached copper foil has at least one layer selected from a group of a roughened layer, a heat-resistant layer, a rustproofing layer, a chromate treated layer, and a silane coupling-treated layer, and

when the carrier-attached copper foil according to claim 1 has the ultra-thin copper layer on one face of the carrier, the at least one layer is on at least one or both of a surface on a side of the ultra-thin copper layer and a surface on a side of the carrier, or

when the carrier-attached copper foil according to claim 1 has the ultra-thin copper layer on each of both faces of the carrier, the at least one layer is on one or both of surfaces on sides of the ultra-thin copper layer.

12. The carrier-attached copper foil according to claim 11 , wherein the roughened layer is a layer of an alloy including any one or at least one selected from a group consisting of copper, nickel, phosphorus, tungsten, arsenic, molybdenum, chromium, titanium, iron, vanadium, cobalt, and zinc.

13. The carrier-attached copper foil according to claim 11 , wherein the carrier-attached copper foil has a resin layer on the at least one layer selected from the group of the roughened layer, the heat-resistant layer, the rustproofing layer, the chromate treated layer, and the silane coupling-treated layer.

14. The carrier-attached copper foil according to claim 1 , wherein a resin layer is provided on the ultra-thin copper layer.

15. A laminate comprising the carrier-attached copper foil according to claim 1 , and a resin layer or a prepreg layer.

16. A method of manufacturing a printed wiring board comprising:

providing two layers including a resin layer and a circuit at least once on any one of or both of faces of the laminate according to claim 15 ; and

detaching the carrier and the ultra-thin copper layer from the carrier-attached copper foil that forms the laminate after forming the two layers including the resin layer and the circuit.

17. A laminate comprising the carrier-attached copper foil according to claim 1 and a resin,

wherein a portion or all of edge faces of the carrier-attached copper foil is covered with the resin.

18. A laminate comprising two carrier-attached copper foils according to claim 1 and a resin,

wherein the two carrier-attached copper foils are provided on the resin so that a surface on a side of the ultra-thin copper layer of one carrier-attached copper foil of the two carrier-attached copper foils and a surface on a side of the ultra-thin copper layer of another carrier-attached copper foil are exposed.

19. A laminate wherein the carrier-attached copper foil according to claim 1 is laminated from a side of the carrier or a side of the ultra-thin copper layer on a side of the carrier or a side of the ultra-thin copper layer of another carrier-attached copper foil according to claim 1 .

20. A method of manufacturing a printed wiring board comprising:

preparing the carrier-attached copper foil according to claim 1 and an insulating substrate;

laminating the carrier-attached copper foil and the insulating substrate;

detaching the carrier from the carrier-attached copper foil after the carrier-attached copper foil and the insulating substrate are laminated to form a copper-clad laminate; and

forming a circuit by any one of a semi-additive method, a subtractive method, a partly additive method, and a modified semi-additive method.

21. An electronic device manufacturing method of manufacturing an electronic device by using a printed wiring board manufactured by the method according to claim 20 .

22. A method of manufacturing a printed wiring board comprising:

forming a circuit on a surface on a side of the ultra-thin copper layer or a surface on a side of the carrier of the carrier-attached copper foil according to claim 1 ;

forming a resin layer on the surface on the side of the ultra-thin copper layer or the surface on the side of the carrier of the carrier-attached copper foil so that the circuit is buried;

detaching the carrier or the ultra-thin copper layer after forming the resin layer; and

exposing, after detaching the carrier or the ultra-thin copper layer, the circuit that is formed on the surface on the side of the ultra-thin copper layer or the surface on the side of the carrier and is buried in the resin layer by removing the carrier or the ultra-thin copper layer.

23. A method of manufacturing a printed wiring board comprising:

laminating the carrier-attached copper foil according to claim 1 on a resin substrate so as to attach a side of the carrier to the resin substrate;

forming a circuit on the surface on the side of the ultra-thin copper layer of the carrier-attached copper foil;

forming a resin layer on the surface on the side of the ultra-thin copper layer of the carrier-attached copper foil so that the circuit is buried;

detaching the carrier after forming the resin layer; and

exposing, after detaching the carrier, the circuit that is formed on the surface on the side of the ultra-thin copper layer and is buried in the resin layer by removing the ultra-thin copper layer.

24. A method of manufacturing a printed wiring board, comprising:

laminating the carrier-attached copper foil according to claim 1 on a resin substrate so as to attach a surface on a side of the ultra-thin copper layer or a surface on a side of the carrier to the resin substrate;

providing two layers including a resin layer and a circuit at least once on the surface on the side of the ultra-thin copper layer or the surface on the side of the carrier of the carrier-attached copper foil, the surface on the side of the ultra-thin copper layer or the surface on the side of the carrier being an opposite side of a side to which the resin substrate is laminated; and

detaching the carrier or the ultra-thin copper layer from the carrier-attached copper foil after forming the two layers including the resin layer and the circuit.