IP Library Assignment 039245/0527
Patent Assignment
Reel/Frame 039245/0527

Assignment of Assignor's Interest

Recorded: 2016-07-25 Pages: 3
Assignors
MORIYAMA, TERUMASA
Executed: 2016-06-21
NAGAURA, TOMOTA
Executed: 2016-06-21
Assignee
JX NIPPON MINING & METALS CORPORATION
1-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 1008164, JAPAN
Covered Property (1)
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device
Application: 15/218,449 →
Publication: US 2017/0034926
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →