IP Library Granted Patent US 7,338,902
Granted Patent B2
US 7,338,902 · App. 10/534,695 · Granted Mar 4, 2008

Epitaxial growth method and substrate for epitaxial growth

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Quick Facts
Patent No.
US 7,338,902
App. No.
10/534,695
Granted
Mar 4, 2008
Kind
B2
Abstract

An epitaxial growth method includes: supporting a substrate for growth (for example, an InP substrate) with a substrate supporter, growing a compound semiconductor layer comprising 3 or 4 elements (for example, a III-V group compound semiconductor such as an InGaAs layer, AlGaAs layer, AlInAs layer and AlInGaAs layer) on the substrate for growth by metal organic chemical vapor deposition, polishing the substrate so that an angle of gradient is 0.00° to 0.03° or 0.04° to 0.24° with respect to (100) direction in the entire effective area of the substrate, and forming the compound semiconductor layer to be 0.5 μm thick or more on the substrate by using the substrate for growth.

Claims (18)

1. An epitaxial growth method comprising: supporting a substrate for growth with a substrate supporter, forming a III-V compound semiconductor layer comprising 3 or 4 elements on the substrate for growth by metal organic chemical vapor deposition, polishing the substrate so that an angle of gradient is not in the range from above 0.03° to below 0.04° with respect to (100) direction in an entire effective area of the substrate, and forming the compound semiconductor layer to be 0.5 μm thick or more on the substrate by using the substrate for growth,

wherein the 3 or 4 elements are selected from the group consisting of AlGaAs, AlInAs, AlInGaAs and combinations thereof, and

wherein the dislocation density of the substrate is 5000 cm −2 or less.

2. The epitaxial growth method as claimed in claim 1 , further comprising: forming a buffer layer on the substrate for growth, and forming the compound semiconductor layer on the buffer layer.

3. The epitaxial growth method as claimed in claim 2 , wherein the compound semiconductor layer comprises AlInAs.

4. The epitaxial growth method as claimed in claim 3 , wherein the substrate for growth is a semiconductor crystal substrate having dislocation density of 5000 cm −2 or less.

5. The epitaxial growth method as claimed in claim 4 , wherein the substrate for growth is an InP substrate.

6. The epitaxial growth method as claimed in claim 2 , wherein the substrate for growth is a semiconductor crystal substrate having a dislocation density of 5000 cm −2 or less.

7. The epitaxial growth method as claimed in claim 6 , wherein the substrate for growth is an InP substrate.

8. The epitaxial growth method as claimed in claim 1 , wherein the compound semiconductor layer comprises AlInAs.

9. The epitaxial growth method as claimed in claim 8 , wherein the substrate for growth is a semiconductor crystal substrate having dislocation density of 5000 cm −2 or less.

10. The epitaxial growth method as claimed in claim 9 , wherein the substrate for growth is an InP substrate.

11. The epitaxial growth method as claimed in claim 1 , wherein the substrate for growth is a semiconductor crystal substrate having a dislocation density of 5000 cm −2 or less.

12. The epitaxial growth method as claimed in claim 11 , wherein the substrate for growth is an InP substrate.

13. A substrate for epitaxial growth used for an epitaxial growth method in which a compound semiconductor layer comprising 3 or 4 elements is formed on the substrate for growth by metal organic chemical vapor deposition, wherein an angle of gradient is not in the range from above 0.03° to below 0.04° with respect to (100) direction in an entire effective area of the substrate.

14. The substrate for epitaxial growth as claimed in claim 13 , wherein the substrate is a semiconductor crystal substrate having dislocation density of 5000 cm −2 or less.

15. The substrate for epitaxial growth as claimed in claim 14 , wherein the substrate is an InP substrate.

16. The substrate for epitaxial growth as claimed in claim 13 , wherein the substrate is an InP substrate.

Assignments (5)
CHANGE OF ADDRESS Recorded Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →
CHANGE OF ADDRESS Recorded Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
CHANGE OF NAME/MERGER Recorded Jun 9, 2011
From: NIPPON MINING & METALS CO., LTD.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 026417/0023 →
CHANGE OF NAME Recorded Sep 18, 2006
From: NIKKO MATERIALS CO., LTD.
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 018268/0048 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2005
From: NAKAMURA, MASASHI; KURITA, HIDEKI
To: NIKKO MATERIALS CO., LTD.
Reel/Frame 016981/0235 →