IP Library › Assignment 012694/0032
Patent Assignment
Reel/Frame 012694/0032

Assignment of Assignor's Interest

Recorded: 2002-03-06 Pages: 2
Assignor
YASUDA, NAOYA
Executed: 2002-02-06
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
CHIYODA-KU, 2-3, MARUNOUCHI 2-CHOME, TOKYO 100-8310, JAPAN
Covered Property (1)
Resin Sealing Apparatus and Resin Sealing Method
Patent: 6,713,882 →
Application: 10/091,303 →
Publication: US 2003/0052418
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name Sep 15, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024990/0536 →