Patent Assignment
Reel/Frame 012697/0443
Assignment of Assignor's Interest
Recorded: 2002-03-11
Received: 2002-03-25
Pages: 3
Assignor
PARKS, JAY S.
Executed: 2002-02-22
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, ID, 83716, UNITED STATES
Covered Properties
(2)
Microelectronic Die Including Low Rc Under-Layer Interconnects
Application:
10/095,362 →
Electrical Load Management in Conjunction with Idle Shutdown
Application:
10/074,196 →