IP Library › Granted Patent US 6,624,515
Granted Patent Utility
US 6,624,515 · Confirmation No. 6626

MICROELECTRONIC DIE INCLUDING LOW RC UNDER-LAYER INTERCONNECTS

Inventor: Jay S. Parks
Patented Case View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2016-02-09 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2003-07-07 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-07-07 LET. Miscellaneous Incoming Letter 1 View
2002-03-11 TRNA Transmittal of New Application 1 View
2002-03-11 SPEC Specification 13 View
2002-03-11 CLM Claims 16 View
2002-03-11 ABST Abstract 1 View
2002-03-11 DRW Drawings-only black and white line drawings 8 View
2002-03-11 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,624,515
App. No.
10/095,362
Filed
2002-03-11
Granted
2003-09-23
Pub. No.
US20030168742A1
Art Unit
2818
PTA
-10 days