IP Library Granted Patent US 6,784,026
Granted Patent Utility
US 6,784,026 · Confirmation No. 9016

MICROELECTRONIC DIE INCLUDING LOW RC UNDER-LAYER INTERCONNECTS

Inventor: Jay S. Parks
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2004-04-15 NOA Notice of Allowance and Fees Due (PTOL-85) 3 View
2004-04-15 NOA Notice of Allowance and Fees Due (PTOL-85) 5 View
2004-04-15 IIFW Issue Information including classification, examiner, name, claim, renumbering, etc. 1 View
2004-04-15 FWCLM Index of Claims 1 View
2004-04-15 SRFW Search information including classification, databases and other search related notes 1 View
2004-03-24 WFEE Fee Worksheet (SB06) 1 View
2004-03-24 FWCLM Index of Claims 1 View
2004-03-15 A... Amendment/Request for Reconsideration-After Non-Final Rejection 2 View
2004-03-15 CLM Claims 5 View
2004-03-15 REM Applicant Arguments/Remarks Made in an Amendment 5 View
2003-12-10 CTNF Non-Final Rejection 9 View
2003-12-10 1449 List of References cited by applicant and considered by examiner 2 View
2003-12-10 892 List of references cited by examiner 1 View
2003-12-10 FWCLM Index of Claims 1 View
2003-12-10 SRFW Search information including classification, databases and other search related notes 1 View
2003-12-10 SRNT Examiner's search strategy and results 2 View
2003-11-19 SRNT Examiner's search strategy and results 3 View
2003-11-17 SRNT Examiner's search strategy and results 5 View
2003-04-30 TRNA Transmittal of New Application 1 View
2003-04-30 A.PE Preliminary Amendment 1 View
2003-04-30 SPEC Specification 13 View
2003-04-30 CLM Claims 16 View
2003-04-30 ABST Abstract 1 View
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Quick Facts
Patent No.
US 6,784,026
App. No.
10/428,449
Filed
2003-04-30
Granted
2004-08-31
Pub. No.
US20030205732A1
Art Unit
2818
PTA
-9 days