IP Library › Assignment 012705/0966
Patent Assignment
Reel/Frame 012705/0966

Assignment of Assignor's Interest

Recorded: 2002-03-21 Pages: 4
Assignors
ZHAO, SAM ZIQUN
Executed: 2002-01-30
KHAN, REZA-UR RAHMAN
Executed: 2002-01-30
LAW, EDWARD
Executed: 2002-03-04
PAPAGEORGE, MARC
Executed: 2002-02-15
Assignee
BROADCOM CORPORATION
C/O DEE HENDERSON, 16215 ALTON PARKWAY, IRVINE, CALIFORNIA, 92618
Covered Property (1)
Thermally and Electrically Enhanced Ball Grid Array Packaging
Patent: 6,882,042 →
Application: 09/997,272 →
Publication: US 2002/0135065
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
Assignment of Assignor's Interest Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
Termination and Release of Security Interest in Patents Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →