Patent Assignment
Reel/Frame 012715/0882
Assignment of Assignor's Interest
Recorded: 2002-03-21
Received: 2002-03-29
Pages: 3
Assignor
WON, JAE HYUNG
Executed: 2002-03-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KRX, KOREA, REPUBLIC OF
Covered Property
(1)
Pecvd Method of Forming a Tungsten Silicide Layer on a Polysilicon Layer
Application:
10/101,776 →