IP Library Patent Application 10101776
Patent Application Utility
App. No. 10/101,776 · Confirmation No. 8876

PECVD METHOD OF FORMING A TUNGSTEN SILICIDE LAYER ON A POLYSILICON LAYER

Inventor: Jai Hyung Won
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
Code Description Pages PDF
2002-03-21 TRNA Transmittal of New Application 4 View
2002-03-21 SPEC Specification 17 View
2002-03-21 CLM Claims 5 View
2002-03-21 ABST Abstract 1 View
2002-03-21 DRW Drawings-only black and white line drawings 8 View
2002-03-21 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
10/101,776
Filed
2002-03-21
Granted
2003-06-03
Pub. No.
US20020137336A1
Art Unit
2813
PTA
-117 days