Patent Assignment
Reel/Frame 012741/0069
Assignment of Assignor's Interest
Recorded: 2002-03-25
Received: 2002-04-04
Pages: 2
Assignors
LIEW, WEE KEONG
Executed: 2002-03-19
THURAIRAJARATNAM, ARITHARAN
Executed: 2002-03-19
ALAGARATNAM, MANIAM
Executed: 2002-03-20
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BLVD., MILPITAS, CA, 95035, UNITED STATES
Covered Properties
(2)
Integrated Circuit Package Substrate with High Density Routing Mechanism
Application:
10/105,863 →
Multi-Channel Audio Enhancement for Television
Application:
10/103,486 →