IP Library › Granted Patent US 6,608,376
Granted Patent Utility
US 6,608,376 · Confirmation No. 5541

INTEGRATED CIRCUIT PACKAGE SUBSTRATE WITH HIGH DENSITY ROUTING MECHANISM

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2020-06-11 OATH Oath or Declaration filed 262 View
2010-03-02 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2010-03-02 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2010-02-22 PA.. Power of Attorney 1 View
2010-02-22 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2010-02-22 N417 Electronic Filing System Acknowledgment Receipt 2 View
2002-03-25 TRNA Transmittal of New Application 2 View
2002-03-25 SPEC Specification 14 View
2002-03-25 CLM Claims 5 View
2002-03-25 ABST Abstract 1 View
2002-03-25 DRW Drawings-only black and white line drawings 4 View
2002-03-25 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,608,376
App. No.
10/105,863
Filed
2002-03-25
Granted
2003-08-19
Art Unit
2826
PTA
-44 days