Patent Assignment
Reel/Frame 012776/0365
Assignment of Assignor's Interest
Recorded: 2002-04-04
Received: 2002-04-15
Pages: 2
Assignee
THERMAGON, INC.
4707 DETROIT AVENUE, CLEVELAND, OH, 44102, UNITED STATES
Covered Properties
(3)
Multi-Layer Structure and Method for Forming a Thermal Interface with Low Contact Resistance Between a Microelectronic Component Package and Heat Sink
Application:
10/116,573 →
Sequential Presentation of Long Instructions in an Interactive Voice Response System
Application:
10/058,785 →
Optical Systems Employing Anamorphic Beams and Diffraction Gratings
Application:
10/056,452 →