IP Library › Granted Patent US 6,617,517
Granted Patent Utility
US 6,617,517 · Confirmation No. 2942

MULTI-LAYER STRUCTURE AND METHOD FOR FORMING A THERMAL INTERFACE WITH LOW CONTACT RESISTANCE BETWEEN A MICROELECTRONIC COMPONENT PACKAGE AND HEAT SINK

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Quick Facts
Patent No.
US 6,617,517
App. No.
10/116,573
Filed
2002-04-04
Granted
2003-09-09
Pub. No.
US20020154485A1
Art Unit
2827
PTA
0 days