Patent Assignment
Reel/Frame 041803/0831
Merger
Recorded: 2017-03-31
Pages: 5
Assignor
THERMAGON, INC.
Executed: 2016-12-31
Assignee
LAIRD TECHNOLGIES, INC.
3481 RIDER TRAIL SOUTH, EARTH CITY, MISSOURI, 63045
Covered Properties
(6)
Multi-Layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
Patent:
6,372,997 →
Application:
09/513,483 →
Multi-Layer Structure and Method for Forming a Thermal Interface with Low Contact Resistance Between a Microelectronic Component Package and Heat Sink
Thermal Interface Structure for Placement Between a Microelectronic Component Package and Heat Sink
Heat Sink and Heat Spreader Assembly
Patent:
6,849,941 →
Application:
10/752,612 →
Thermal Interface Assembly and Method for Forming a Thermal Interface Between a Microelectronic Component Package and Heat Sink
Heat Spreading Thermal Interface Structure
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.