Granted Patent
Utility
US 6,617,517 · App. 10/116,573
Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink
Inventors:
Richard F. Hill, Jason L. Strader
Patented Case
View Patent ↗
Granted: Sep 9, 2003
Filed: Apr 4, 2002
Inventors
Richard F. Hill
Jason L. Strader
Assignee (at issue)
Thermagon, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.