IP Library Assignment 012780/0164
Patent Assignment
Reel/Frame 012780/0164

Assignment of Assignor's Interest

Recorded: 2002-04-08 Pages: 5
Assignors
POO, CHIA YONG
Executed: 2002-03-22
JEUNG, BOON SUAN
Executed: 2002-03-22
WAF, LOW SIU
Executed: 2002-03-22
YU, CHAN MIN
Executed: 2002-03-22
LOO, NEO YONG
Executed: 2002-03-22
KOON, ENG MEOW
Executed: 2002-03-22
LENG, SER BOK
Executed: 2002-03-22
KWANG, CHUA SWEE
Executed: 2002-03-22
CHUNG, SO CHEE
Executed: 2002-03-22
SENG, HO KWOK
Executed: 2002-03-22
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716
Covered Property (1)
Apparatus and Method for Packaging Circuits
Patent: 6,894,386 →
Application: 10/118,576 →
Publication: US 2003/0067001
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 4, 2010
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 023786/0416 →