IP Library Assignment 012792/0965
Patent Assignment
Reel/Frame 012792/0965

Assignment of Assignor's Interest

Recorded: 2002-04-09 Pages: 6
Assignors
RIES, MICHAEL J.
Executed: 2002-02-01
WILSON, GREGORY M.
Executed: 2002-01-29
STANDLEY, ROBERT W.
Executed: 2002-01-29
SHIVE, LARRY W.
Executed: 2002-01-31
ROSSI, JON A.
Executed: 2002-03-11
Assignee
MEMC ELECTRONIC MATERIALS, INC.
P.O. BOX 8, 501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Property (1)
Semiconductor wafer manufacturing process
Application: 10/036,917 →
Publication: US 2002/0127766
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Mar 19, 2003
From: MEMC ELECTRONIC MATERIALS, INC.; MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
To: CITICORP USA, INC.
Reel/Frame 013964/0378 →