IP Library › Assignment 012804/0507
Patent Assignment
Reel/Frame 012804/0507

Assignment of Assignor's Interest

Recorded: 2002-03-27 Pages: 3
Assignors
CACHINA, JOSEPH
Executed: 2002-03-13
SEIDLER, JACK
Executed: 2002-03-18
ZANOLLI, JAMES R.
Executed: 2002-03-13
Assignee
TEKA INTERCONNECTIONS SYSTEMS, INC.
100 PIONEER AVENUE, WARWICK, RHODE ISLAND, 02888
Covered Property (1)
Solder-Bearing Contacts and Method of Manufacture Thereof and Use in a Solder Ball Grid Array Connector
Patent: 6,543,129 →
Application: 09/801,226 →
Publication: US 2001/0045009
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 24, 2016
From: INTERPLEX INDUSTRIES, INC.
To: STANDARD CHARTERED BANK
Reel/Frame 039007/0209 →
Release of Security Interest Mar 22, 2019
From: STANDARD CHARTERED BANK
To: INTERPLEX INDUSTRIES, INC.
Reel/Frame 048674/0446 →