Patent Assignment
Reel/Frame 012826/0329
Assignment of Assignor's Interest
Recorded: 2002-04-15
Pages: 2
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI BUBAL-EUP, ICHEON-SHI, KYOUNGKI-DI, 467-8, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Multi-Level Interconnections with Dual Damascene Process
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.