Patent Assignment
Reel/Frame 012827/0977
Assignment of Assignor's Interest
Recorded: 2002-04-19
Pages: 2
Assignors
CHO, TAI-HEUI
Executed: 2002-03-29
KANG, HYUCK-JIN
Executed: 2002-03-29
KIM, MIN-CHUL
Executed: 2002-03-29
KIM, BYUNG-YOON
Executed: 2002-03-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Bonding Pad Structure of a Semiconductor Device