Assignment of Assignor's Interest

Recorded: 2002-04-23 Pages: 2

Assignor

KARUBE, YOSHIO

Executed: 2002-04-15

Assignee

NEC CORPORATION

7-1 SHIBA 5 CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Lead frame having semiconductor device mounted thereon and including engageable protectective protrusions and method for fabricating the same

Application: 10/128,204 →

Publication: US 2002/0158315

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.