IP Library › Assignment 012869/0573
Patent Assignment
Reel/Frame 012869/0573

Assignment of Assignor's Interest

Recorded: 2002-05-03 Pages: 3
Assignors
DUBIN, VALERY M.
Executed: 2002-04-08
CHENG, CHIN-CHANG
Executed: 2002-04-09
HUSSEIN, MAKAREM A.
Executed: 2002-04-11
NGUYEN, PHI L.
Executed: 2002-04-18
BRAIN, RUTH A.
Executed: 2002-04-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Use of Conductive Electrolessly Deposited Etch Stop Layers, Liner Layers and via Plugs in Interconnect Structures
Patent: 7,008,872 →
Application: 10/139,052 →
Publication: US 2003/0207560