Patent Assignment
Reel/Frame 012877/0563
Assignment of Assignor's Interest
Recorded: 2002-05-02
Received: 2002-05-14
Pages: 4
Assignors
FAN, CHUN HO
Executed: 2002-04-03
MCLELLAN, NEIL ROBERT
Executed: 2002-04-03
NG, HAU WAN
Executed: 2002-04-03
PUN, TAI WAI
Executed: 2002-04-03
COMBS, EDWARD G.
Executed: 2002-04-15
SHEPPARD, ROBERT P.
Executed: 2002-04-15
Assignee
ASAT LIMITED
QPL INDUSTRIAL BUILDING, 138 TEXACO ROAD, TSUEN WAN, NT, HKX, HONG KONG
Covered Property
(1)
Enhanced Thermal Dissipation Integrated Circuit Package and Method of Manufacturing Enhanced Thermal Dissipation Integrated Circuit Package
Application:
09/902,878 →