IP Library › Granted Patent US 6,734,552
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Granted Patent Utility
US 6,734,552 · Confirmation No. 9162

ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE

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Quick Facts
Patent No.
US 6,734,552
App. No.
09/902,878
Filed
2001-07-11
Granted
2004-05-11
Pub. No.
US20030011064A1
Art Unit
2827
PTA
-394 days