Method of manufacturing an enhanced thermal dissipation integrated circuit package
View Patent ↗In one aspect, the present invention relates to a method of manufacturing an integrated circuit package, the method including installing a carrier onto a substrate, attaching a semiconductor die to the substrate, and aligning an assembly over the semiconductor die, wherein the assembly includes a heat sink and a thermally conductive element. This aspect further includes resting the assembly on the carrier such that the thermally conductive element does not directly contact the semiconductor die, and encapsulating the thermally conductive element and the heat sink such that a portion of the heat sink is exposed to the surroundings of the package.
1. A method of manufacturing an integrated circuit package, comprising:
installing a carrier onto an upper surface of a substrate, wherein said carrier defines a cavity;
attaching a semiconductor die to said upper surface of said substrate within said cavity of said carrier;
aligning an assembly over said semiconductor die, wherein said assembly comprises a heat sink and a thermally conductive element;
resting said assembly on said carrier such that said thermally conductive element does not directly contact said semiconductor die;
encapsulating said cavity to form a prepackage such that a portion of said heat sink is exposed to the surroundings of said package; and
singulating said prepackage to form said package, wherein a top portion and a side portion of said heat sink are exposed to the surroundings of said package.
2. The method of claim 1 , wherein said assembly is rested on said carrier such that said thermally conductive element and said semiconductor die are separated by a distance of about five (5) mils or less.
3. The method of claim 1 , wherein said attaching said semiconductor die to said upper surface of said substrate is by a direct chip attachment.
4. The method of claim 1 , wherein said thermally conductive element is substantially shaped as a right rectangular solid.
5. The method of claim 1 , wherein said heat sink comprises a top portion, a side portion, and an extending finger when viewed from a top of said package, said extending finger comprising said side portion.
6. The method of claim 5 , wherein said extending finger extends from a corner of said heat sink.
7. The method of claim 1 , wherein said encapsulating comprises encapsulating said thermally conductive element and said heat sink such that said top portion and said side portion of said heat sink are exposed to the surroundings of said package.
8. The method of claim 1 , wherein said thermally conductive element is made of a material from the group consisting of alumina, aluminum nitride, beryllium oxide, ceramic material, copper, diamond compound, and metal.
9. The method of claim 1 , wherein said integrated circuit package is a ball grid array integrated circuit package.
10. A method of manufacturing an integrated circuit package, comprising:
installing a carrier onto a substrate;
attaching a semiconductor die to said substrate;
aligning an assembly over said semiconductor die, wherein said assembly comprises a heat sink and a thermally conductive element;
resting said assembly on said carrier such that said thermally conductive element does not directly contact said semiconductor die;
encapsulating said thermally conductive element and said heat sink such that a portion of said heat sink is exposed to the surroundings of said package; and
singulating, wherein a top portion and a side portion of said heat sink are exposed to the surroundings of said package.
11. The method of claim 10 , wherein said thermally conductive element is substantially shaped as a right rectangular solid.
12. The method of claim 10 , wherein said heat sink comprises a top portion, a side portion, and an extending finger when viewed from a top of said package, said extending finger comprising said side portion.
13. The method of claim 12 , wherein said extending finger extends from a corner of said heat sink.
14. The method of claim 10 , wherein said encapsulating comprises encapsulating said thermally conductive element and said heat sink such that said top portion and said side portion of said heat sink are exposed to the surroundings of said package.
15. The method of claim 10 , wherein said thermally conductive element is made of a material from the group consisting of alumina, aluminum nitride, beryllium oxide, ceramic material, copper, diamond compound, and metal.
16. The method of claim 10 , wherein said integrated circuit package is a ball grid array integrated circuit package.
17. The method of claim 10 , wherein said assembly is rested on said carrier such that said thermally conductive element and said semiconductor die are separated by a distance of about five (5) mils or less.
18. The method of claim 10 , wherein said attaching said semiconductor die to said substrate is by a direct chip attachment.