Patent Assignment
Reel/Frame 039822/0591
Corrective Assignment to Correct the Add Annex Inadvertently Left Out Original Assignment Document Previously Recorded at Reel: 037880 Frame: 0534. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2016-07-08
Pages: 13
Assignor
UTAC HONG KONG LIMITED
Executed: 2015-05-08
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Properties
(69)
Molded Plastic Package with Heat Sink and Enhanced Electrical Performance
Patent:
6,326,678 →
Application:
08/116,305 →
Structure and Method for Automated Assembly of a Tab Grid Array Package
Patent:
5,843,808 →
Application:
08/585,134 →
Integrated Carrier Ring/Stiffener and Method for Manufacturing a Flexible Integrated Circuit Package
Patent:
6,111,324 →
Application:
09/020,903 →
Integrated Circuit Package with Bonding Planes on a Ceramic Ring Using an Adhesive Assembly
Patent:
6,285,075 →
Application:
09/184,787 →
Integrated Carrier Ring/Stiffener and Method for Manufacturing a Flexible Integrated Circuit Package
Patent:
6,284,569 →
Application:
09/309,248 →
Metal Foil Laminated Ic Package
Leadless Plastic Chip Carrier with Etch Back Pad Singulation
Leadless Plastic Chip Carrier with Etch Back Pad Singulation and Die Attach Pad Array
Enhanced Thermal Dissipation Integrated Circuit Package and Method of Manufacturing Enhanced Thermal Dissipation Integrated Circuit Package
Method of Manufacturing an Integrated Circuit Package
Multiple Leadframe Laminated Ic Package
Patent:
6,734,044 →
Application:
10/166,458 →
Integrated Circuit Package and Method of Manufacturing the Integrated Circuit Package
Ball Grid Array Package
Patent:
6,800,948 →
Application:
10/197,832 →
Chip Scale Integrated Circuit Package
Patent:
6,667,191 →
Application:
10/211,567 →
Premolded Cavity Ic Package
Patent:
6,821,817 →
Application:
10/232,678 →
Ball Grid Array Package with Shielding
Patent:
6,818,978 →
Application:
10/299,622 →
Thin Ball Grid Array Package
Patent:
6,781,242 →
Application:
10/307,279 →
Leadless Plastic Chip Carrier with Etch Back Pad Singulation and Die Attach Pad Array
Patent:
6,872,661 →
Application:
10/318,262 →
Ball Grid Array Package with Improved Thermal Characteristics
Patent:
6,737,755 →
Application:
10/322,661 →
Process for Manufacturing Ball Grid Array Package
Patent:
6,979,594 →
Application:
10/323,657 →
Shielded Integrated Circuit Package
Patent:
7,071,545 →
Application:
10/323,658 →
Leadless Plastic Chip Carrier with Etch Back Pad Singulation
Patent:
6,989,294 →
Application:
10/353,241 →
Ball Grid Array Package
Patent:
6,818,472 →
Application:
10/372,421 →
Stacked Semiconductor Package and Method of Manufacturing the Same
Patent:
6,818,980 →
Application:
10/430,331 →
Ball Grid Array Package and Process for Manufacturing Same
Patent:
6,987,032 →
Application:
10/643,961 →
Ball Grid Array Package and Process for Manufacturing Same
Patent:
6,933,176 →
Application:
10/647,696 →
Ball Grid Array Package and Process for Manufacturing Same
Patent:
7,372,151 →
Application:
10/660,611 →
Method of Fabricating a Leadless Plastic Chip Carrier
Patent:
7,033,517 →
Application:
10/661,480 →
Thin Ball Grid Array Package
Patent:
7,439,099 →
Application:
10/678,417 →
Flip Chip Ball Grid Array Package
Patent:
7,224,048 →
Application:
10/678,419 →
Multiple Leadframe Laminated Ic Package
Patent:
7,449,771 →
Application:
10/681,983 →
Thermally Enhanced Cavity-Down Integrated Circuit Package
Patent:
6,984,785 →
Application:
10/694,511 →
Process for Fabricating a Leadless Plastic Chip Carrier
Patent:
6,946,324 →
Application:
10/697,339 →
Electronic Components Such as Thin Array Plastic Packages and Process for Fabricating Same
Patent:
6,964,918 →
Application:
10/757,499 →
Thin Leadless Plastic Chip Carrier
Patent:
7,009,286 →
Application:
10/757,508 →
Sensor Semiconductor Package and Method of Manufacturing the Same
Patent:
6,982,491 →
Application:
10/759,247 →
Leadless Plastic Chip Carrier with Standoff Contacts and Die Attach Pad
Patent:
7,049,177 →
Application:
10/765,192 →
Premolded Cavity Ic Package
Patent:
6,841,859 →
Application:
10/800,973 →
Method of Manufacturing an Enhanced Thermal Dissipation Integrated Circuit Package
Integrated Circuit Package and Process for Fabricating the Same
Patent:
7,091,581 →
Application:
10/865,760 →
Ball Grid Array Package That Includes a Collapsible Spacer for Separating Die Adapter from a Heat Spreader
Patent:
7,315,080 →
Application:
10/885,965 →
Shielded Integrated Circuit Package
Patent:
7,381,588 →
Application:
10/885,966 →
Integrated Circuit Package with Partially Exposed Contact Pads and Process for Fabricating the Same
Patent:
7,411,289 →
Application:
10/891,709 →
Leadless Plastic Chip Carrier with Contact Standoff
Patent:
7,595,225 →
Application:
10/957,576 →
Cavity-Type Integrated Circuit Package
Patent:
7,732,914 →
Application:
10/985,233 →
Process for Fabricating an Integrated Circuit Package with Reduced Mold Warping
Patent:
7,371,610 →
Application:
10/990,008 →
Integrated Circuit Package Having a Plurality of Spaced Apart Pad Portions
Patent:
8,330,270 →
Application:
11/008,593 →
Leadless Plastic Chip Carrier
Patent:
7,270,867 →
Application:
11/022,130 →
Thin Array Plastic Package Without Die Attach Pad and Process for Fabricating the Same
Ball Grid Array Package with Improved Thermal Characteristics
Patent:
8,610,262 →
Application:
11/061,895 →
Electronic Components Such as Thin Array Plastic Packages and Process for Fabricating Same
Patent:
7,482,690 →
Application:
11/071,737 →
Leadless Plastic Chip Carrier with Etch Back Pad Singulation
Patent:
6,995,460 →
Application:
11/123,489 →
Leadless Plastic Chip Carrier with Etch Back Pad Singulation
Patent:
7,271,032 →
Application:
11/123,491 →
Process for Fabricating an Integrated Circuit Package
Patent:
7,247,526 →
Application:
11/137,973 →
Thin Leadless Plastic Chip Carrier
Patent:
7,081,403 →
Application:
11/151,469 →
Process for Fabricating a Leadless Plastic Chip Carrier
Patent:
7,226,811 →
Application:
11/175,663 →
Integrated Circuit Package and Method for Fabricating Same
Patent:
7,348,663 →
Application:
11/183,290 →
Thermally Enhanced Cavity-Down Integrated Circuit Package
Patent:
7,342,305 →
Application:
11/191,678 →
Process for Fabricating Pad Frame and Integrated Circuit Package
Patent:
7,232,755 →
Application:
11/194,993 →
Leadless Plastic Chip Carrier and Method of Fabricating Same
Patent:
7,410,830 →
Application:
11/234,963 →
Integrated Circuit Package and Method for Fabricating Same
Patent:
7,344,920 →
Application:
11/798,417 →
Etch Isolation Lpcc/Qfn Strip
Leadless Integrated Circuit Package Having Standoff Contacts and Die Attach Pad
Leadless Integrated Circuit Package Having Standoff Contacts and Die Attach Pad
Leadless Array Plastic Package with Various Ic Packaging Configurations
Method of Fabricating an Integrated Circuit (Ic) Package Having a Plurality of Spaced Apart Pad Portions
Leadless Array Plastic Package with Various Ic Packaging Configurations
Ball Grid Array Package with Improved Thermal Characteristics
Leadless Integrated Circuit Package Having Standoff Contacts and Die Attach Pad
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.