Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader
View Patent ↗A ball grid array package is manufactured by mounting a semiconductor die to a first surface of a substrate and mounting a die adapter to the semiconductor die. The semiconductor die is wire bonded to ones of conductive traces of the substrate. A collapsible spacer is mounted to the substrate and the substrate is releasably clamped to an upper side of a mold cavity. A heat spreader and at least one collapsible spacer are placed in the mold cavity such that the collapsible spacer is disposed between the heat spreader and the substrate. A molding compound is molded in the mold, thereby molding the semiconductor die, the substrate, the wire bonds, the die adapter, the at least one collapsible spacer and the heat spreader into the molding compound to provide a molded package. A ball grid array is formed on a second surface of the substrate, bumps of the ball grid array being electrically connected to the conductive traces and the integrated circuit package is singulated.
1. An integrated circuit package comprising:
a substrate having a plurality of conductive traces;
a semiconductor die mounted on a first surface of said substrate;
a die adapter mounted on said semiconductor die;
a plurality of wire bonds between said semiconductor die and ones of said conductive traces;
a heat spreader disposed proximal to and spaced from said die adapter by at least one collapsible spacer, wherein the collapsible spacer is a substantially spherical ball;
a molding compound encapsulating the semiconductor die, the wire bonds, the die adapter and said collapsible spacer between the substrate and the heat spreader; and
a ball grid array on a second surface of said substrate, bumps of said ball grid array being electrically connected to said conductive traces.
2. The integrated circuit package according to claim 1 , wherein said at least one collapsible spacer comprises a collapsible spacer disposed between and in contact with said heat spreader and said die adapter.
3. The integrated circuit package according to claim 1 , wherein wire bonding further comprises ground wire bonding said semiconductor die to at least one ground pad on said substrate.
4. An integrated circuit package comprising:
a substrate having a plurality of conductive traces;
a semiconductor die mounted on a first surface of said substrate;
a die adapter mounted on said semiconductor die;
a plurality of wire bonds between said semiconductor die and ones of said conductive traces;
a heat spreader disposed proximal to and spaced from said die adapter by at least one collapsible spacer;
a molding compound encapsulating the semiconductor die, the wire bonds, the die adapter and said collapsible spacer between the substrate and the heat spreader; and
a ball grid array on a second surface of said substrate, bumps of said ball grid array being electrically connected to said conductive traces,
wherein said at least one collapsible spacer further comprises a plurality of collapsible spacers disposed between and in contact with said heat spreader and said substrate array.
5. An integrated circuit package comprising:
a substrate having a plurality of conductive traces;
a semiconductor die mounted on a first surface of said substrate;
a die adapter mounted on said semiconductor die;
a plurality of wire bonds between said semiconductor die and ones of said conductive traces;
a heat spreader disposed proximal to and spaced from said die adapter by at least one collapsible spacer;
a molding compound encapsulating the semiconductor die, the wire bonds, the die adapter and said collapsible spacer between the substrate and the heat spreader; and
a ball grid array on a second surface of said substrate, bumps of said ball grid array being electrically connected to said conductive traces,
wherein wire bonding further comprises ground wire bonding said semiconductor die to said die adapter.