Patent Assignment
Reel/Frame 024599/0827
Grant of Security Interest in Patent Rights - Second Priority
Recorded: 2010-06-29
Received: 2010-06-29
Pages: 11
Assignor
UTAC HONG KONG LIMITED
Executed: 2010-06-04
Assignee
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
P.O. BOX 2558, HOUSTON, TX, 77252, UNITED STATES
Covered Properties
(65)
Etch Isolation Lpcc/Qfn Strip
Application:
11/916,242 →
Leadless Integrated Circuit Package Having Standoff Contacts and Die Attach Pad
Application:
12/400,391 →
Dslr Camera Wrap
Application:
29/321,538 →
Paper Towel Dispenser
Application:
29/283,518 →
Integrated Circuit Package and Method for Fabricating Same
Application:
11/798,417 →
Ball grid array package and process for manufacturing same
Application:
11/377,425 →
Leadless Plastic Chip Carrier and Method of Fabricating Same
Application:
11/234,963 →
Process for Fabricating Pad Frame and Integrated Circuit Package
Application:
11/194,993 →
Thermally Enhanced Cavity-Down Integrated Circuit Package
Application:
11/191,678 →
Integrated Circuit Package and Method for Fabricating Same
Application:
11/183,290 →
Process for Fabricating a Leadless Plastic Chip Carrier
Application:
11/175,663 →
Thin Leadless Plastic Chip Carrier
Application:
11/151,469 →
Process for Fabricating an Integrated Circuit Package
Application:
11/137,973 →
Leadless Plastic Chip Carrier with Etch Back Pad Singulation
Application:
11/123,491 →
Leadless Plastic Chip Carrier with Etch Back Pad Singulation
Application:
11/123,489 →
Electronic Components Such as Thin Array Plastic Packages and Process for Fabricating Same
Application:
11/071,737 →
Ball Grid Array Package with Improved Thermal Characteristics
Application:
11/061,895 →
Thin Array Plastic Package Without Die Attach Pad and Process for Fabricating the Same
Application:
11/033,928 →
Leadless Plastic Chip Carrier
Application:
11/022,130 →
Integrated Circuit Package Having a Plurality of Spaced Apart Pad Portions
Application:
11/008,593 →
Process for Fabricating an Integrated Circuit Package with Reduced Mold Warping
Application:
10/990,008 →
Cavity-Type Integrated Circuit Package
Application:
10/985,233 →
Leadless Plastic Chip Carrier with Contact Standoff
Application:
10/957,576 →
Integrated Circuit Package with Partially Exposed Contact Pads and Process for Fabricating the Same
Application:
10/891,709 →
Shielded Integrated Circuit Package
Application:
10/885,966 →
Ball Grid Array Package That Includes a Collapsible Spacer for Separating Die Adapter from a Heat Spreader
Application:
10/885,965 →
Integrated Circuit Package and Process for Fabricating the Same
Application:
10/865,760 →
Method of Manufacturing an Enhanced Thermal Dissipation Integrated Circuit Package
Application:
10/803,782 →
Premolded Cavity Ic Package
Application:
10/800,973 →
Leadless Plastic Chip Carrier with Standoff Contacts and Die Attach Pad
Application:
10/765,192 →
Sensor Semiconductor Package and Method of Manufacturing the Same
Application:
10/759,247 →
Electronic Components Such as Thin Array Plastic Packages and Process for Fabricating Same
Application:
10/757,499 →
Thin Leadless Plastic Chip Carrier
Application:
10/757,508 →
Process for Fabricating a Leadless Plastic Chip Carrier
Application:
10/697,339 →
Thermally Enhanced Cavity-Down Integrated Circuit Package
Application:
10/694,511 →
Multiple Leadframe Laminated Ic Package
Application:
10/681,983 →
Flip Chip Ball Grid Array Package
Application:
10/678,419 →
Thin Ball Grid Array Package
Application:
10/678,417 →
Method of Fabricating a Leadless Plastic Chip Carrier
Application:
10/661,480 →
Ball Grid Array Package and Process for Manufacturing Same
Application:
10/660,611 →
Process for Dressing Molded Array Package Saw Blade
Application:
10/660,612 →
Ball Grid Array Package and Process for Manufacturing Same
Application:
10/647,696 →
Ball Grid Array Package and Process for Manufacturing Same
Application:
10/643,961 →
Stacked Semiconductor Package and Method of Manufacturing the Same
Application:
10/430,331 →
Ball Grid Array Package
Application:
10/372,421 →
Leadless Plastic Chip Carrier with Etch Back Pad Singulation
Application:
10/353,241 →
Shielded Integrated Circuit Package
Application:
10/323,658 →
Process for Manufacturing Ball Grid Array Package
Application:
10/323,657 →
Ball Grid Array Package with Improved Thermal Characteristics
Application:
10/322,661 →
Leadless Plastic Chip Carrier with Etch Back Pad Singulation and Die Attach Pad Array
Application:
10/318,262 →
Thin Ball Grid Array Package
Application:
10/307,279 →
Ball Grid Array Package with Shielding
Application:
10/299,622 →
Molded Plastic Package with Heat Sink and Enhanced Electrical Performance
Application:
10/269,332 →
Premolded Cavity Ic Package
Application:
10/232,678 →
Chip Scale Integrated Circuit Package
Application:
10/211,567 →
Ball Grid Array Package
Application:
10/197,832 →
Integrated Circuit Package and Method of Manufacturing the Integrated Circuit Package
Application:
10/178,372 →
Multiple Leadframe Laminated Ic Package
Application:
10/166,458 →
Leadless Plastic Chip Carrier with Partial Etch Die Attach Pad
Application:
10/115,228 →
Method of Manufacturing an Integrated Circuit Package
Application:
10/062,650 →
Enhanced Thermal Dissipation Integrated Circuit Package and Method of Manufacturing Enhanced Thermal Dissipation Integrated Circuit Package
Application:
09/902,878 →
Leadless Plastic Chip Carrier with Etch Back Pad Singulation and Die Attach Pad Array
Application:
09/802,679 →
Leadless Plastic Chip Carrier with Etch Back Pad Singulation
Application:
09/802,678 →
Enhanced Leadless Chip Carrier
Application:
09/799,968 →
Molded Plastic Package with Heat Sink and Enhanced Electrical Performance
Application:
09/757,729 →