IP Library Patent Application 10166458
Patent Application Utility
App. No. 10/166,458 · Confirmation No. 4519

MULTIPLE LEADFRAME LAMINATED IC PACKAGE

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗
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Code Description Pages PDF
2009-06-19 TRAN.LET Transmittal Letter 1 View
2009-06-19 PET.POA.WDRW Request for withdrawal as attorney or agent 2 View
2009-06-19 N417 Electronic Filing System Acknowledgment Receipt 2 View
2004-03-04 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-06-10 TRNA Transmittal of New Application 3 View
2002-06-10 SPEC Specification 6 View
2002-06-10 CLM Claims 2 View
2002-06-10 ABST Abstract 1 View
2002-06-10 DRW Drawings-only black and white line drawings 9 View
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Quick Facts
App. No.
10/166,458
Filed
2002-06-10
Granted
2004-05-11
Art Unit
2824
PTA
0 days