Process for dressing molded array package saw blade

1. A process for dressing a saw blade, comprising:

rotating the saw blade on a spindle; and

ablating an edge portion of the saw blade using a laser thereby dressing said saw blade.

2. The process according to claim 1 , wherein ablating said edge portion of the saw blade comprises ablating the edge portion of the saw blade using a high energy laser.

3. The process according to claim 1 , further comprising marking the saw blade to indicate that said saw blade is dressed and to indicate the number of times the saw blade has been dressed.

4. A process for reworking a saw blade used in wafer dicing and singulation of molded array IC packages, the process comprising:

mounting the saw blade on a spindle in a dressing device;

rotating the saw blade on said spindle;

feeding said saw blade into a laser beam for removing an edge portion of the saw blade.

5. The process according to claim 4 , wherein feeding comprises feeding the saw blade into a high energy laser beam.

6. The process according to claim 4 , further comprising marking the saw blade with an indicator to thereby indicate that the saw blade is reworked.

7. A process for dressing a saw blade used in wafer dicing and singulation of molded array IC packages, the process comprising:

rotating the saw blade on a spindle; and

ablating an edge portion of the saw blade using a high energy laser thereby dressing said saw blade.