Shielded integrated circuit package
View Patent ↗An integrated circuit package is provided. The package includes a die attach pad having a first side and a second side. A first semiconductor die is mounted to the first side of the die attach pad, a plurality of contact pads disposed in close proximity to the first semiconductor die. A first plurality of wire bonds connect the first semiconductor die and ones of the contact pads. An overmold encapsulates the first plurality of wire bonds and the first semiconductor die, the die attach pad and the contact pads being embedded in the overmold. A plurality of leads are disposed proximal the second side of the die attach pad. A second semiconductor die is mounted to one of the second side of the die attach pad and ones of the plurality of leads such that the ones of the plurality of leads are electrically connected to the second semiconductor die. The second semiconductor die and the leads are embedded in an encapsulant. The die attach pad shields the second semiconductor die.
1. A shielded integrated circuit package comprising:
a die attach pad having a first side and a second side;
a first semiconductor die directly mounted to said first side of said die attach pad;
a plurality of contact pads disposed in close proximity to said first semiconductor die;
a first plurality of wire bonds connecting said first semiconductor die and ones of said plurality of contact pads;
an overmold encapsulating said first plurality of wire bonds and said first semiconductor die, said die attach pad and said plurality of contact pads being embedded in said overmold;
a plurality of leads disposed proximal said second side of said die attach pad, said plurality of leads being fixed to and electrically connected to said plurality of contact pads by one of an electrically conductive adhesive and a solder;
a second semiconductor die mounted to one of said second side of said die attach pad and said plurality of leads, such that ones of said plurality of leads are also electrically connected to said second semiconductor die;
an encapsulant in which said second semiconductor die and said plurality of leads are embedded,
wherein said die attach pad shields radio frequency and electromagnetic interference signals from being transmitted to or from said second semiconductor die.
2. The shielded integrated circuit package according to claim 1 , wherein said second semiconductor die is directly mounted to said second side of said die attach pad and a second plurality of wire bonds connect said second semiconductor die and said ones of said leads.
3. The shielded integrated circuit package according to claim 1 , wherein said second semiconductor die is flip-chip mounted to said ones of said leads, thereby electrically connecting said ones of said leads to said second semiconductor die.
4. The shielded integrated circuit package according to claim 1 , wherein sides of ones of said plurality of leads are in electrical contact with sides of ones of said contact pads.
5. The shielded integrated circuit package according to claim 1 , wherein said encapsulant is a glob-top material.
6. The shielded integrated circuit package according to claim 1 , wherein said second semiconductor die is a radio frequency chip.
7. The shielded integrated circuit package according to claim 6 , wherein said first semiconductor die is a complementary metal oxide semiconductor chip.