Patent Assignment
Reel/Frame 012883/0584
Assignment of Assignor's Interest
Recorded: 2002-05-01
Received: 2002-05-15
Pages: 4
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CA, 94538, UNITED STATES
Covered Property
(1)
Tape Ball Grid Array Semiconductor Package Structure and Assembly Process
Application:
10/082,914 →