IP Library › Granted Patent US 6,549,413
Granted Patent Utility
US 6,549,413 · Confirmation No. 2672

TAPE BALL GRID ARRAY SEMICONDUCTOR PACKAGE STRUCTURE AND ASSEMBLY PROCESS

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2016-04-07 OATH Oath or Declaration filed 8 View
2007-10-01 PA.. Power of Attorney 1 View
2007-10-01 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2007-10-01 C.AD Change of Address 1 View
2007-10-01 N417 Electronic Filing System Acknowledgment Receipt 2 View
2002-02-26 TRNA Transmittal of New Application 2 View
2002-02-26 ADS Application Data Sheet 3 View
2002-02-26 SPEC Specification 12 View
2002-02-26 CLM Claims 2 View
2002-02-26 ABST Abstract 1 View
2002-02-26 DRW Drawings-only black and white line drawings 7 View
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Quick Facts
Patent No.
US 6,549,413
App. No.
10/082,914
Filed
2002-02-26
Granted
2003-04-15
Pub. No.
US20020127778A1
Art Unit
2835
PTA
0 days