Patent Assignment
Reel/Frame 038378/0200
Change of Name
Recorded: 2016-04-07
Pages: 8
Assignor
STATS CHIPPAC LTD
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTE
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Properties
(43)
Plastic Semiconductor Package
Tape Ball Grid Array Semiconductor Package Structure and Assembly Process
Method for Manufacturing Plastic Ball Grid Array with Integral Heatsink
Semiconductor Multipackage Module Including Processor and Memory Package Assemblies
Semiconductor Multi-Package Module Having Wire Bond Interconnect Between Stacked Packages
Semiconductor Multi-Package Module Including Stacked-Die Package and Having Wire Bond Interconnect Between Stacked Packages
Semiconductor Multi-Package Module Having Wire Bond Interconnect Between Stacked Packages and Having Electrical Shield
Semiconductor Multi-Package Module Having Package Stacked Over Die-Down Flip Chip Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Semiconductor Multi-Package Module Having Package Stacked Over Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Semiconductor Multi-Package Module Having Inverted Second Package Stacked Over Die-Up Flip-Chip Ball Grid Array (Bga) Package
Semiconductor Multi-Package Module Having Inverted Second Package and Including Additional Die or Stacked Package on Second Package
Semiconductor Multi-Package Module Having Inverted Bump Chip Carrier Second Package
Semiconductor Multi-Package Module Having Inverted Second Package Stacked Over Die-Up Flip-Chip Ball Grid Array (Bga) Package
Semiconductor Stacked Multi-Package Module Having Inverted Second Package and Electrically Shielded First Package
Wire Bond Capillary Tip
Semiconductor Chip Packaging Method with Individually Placed Film Adhesive Pieces
Multiple chip package module having inverted package stacked over die
Semiconductor Multi-Package Module Having Inverted Second Package Stacked Over Die-Up Flip-Chip Ball Grid Array (Bga) Package
Adhesive/Spacer Island Structure for Stacking Over Wire Bonded Die
Method for Manufacturing Plastic Ball Grid Array Package with Integral Heatsink
Multichip Leadframe Package
Wire Bond Interconnection
Semiconductor Package Having Double Layer Leadframe
Semiconductor Flip Chip Package Having Substantially Non-Collapsible Spacer
Programmable Nanotube Interconnect
Method for Making Semiconductor Multi-Package Module Having Inverted Second Package and Including Additional Die or Package Stacked on Second Package
Method for Making a Semiconductor Multi-Package Module Having Inverted Bump Chip Carrier Second Package
Method for Making a Semiconductor Multipackage Module Including a Processor and Memory Package Assemblies
Method of Fabricating a Semiconductor Multi-Package Module Having Inverted Second Package Stacked Over Die-Up Flip-Chip Ball Grid Array (Bga)
Method for Making a Semiconductor Multi-Package Module Having Wire Bond Interconnect Between Stacked Packages
Semiconductor Multi-Package Module Having Package Stacked Over Die-Down Flip Chip Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Adhesive/Spacer Island Structure for Multiple Die Package
Stacked Semiconductor Package Having Adhesive/Spacer Structure and Insulation
Method of Fabricating a Semiconductor Multi-Package Module Having a Second Package Substrate with an Exposed Metal Layer Wire Bonded to a First Package Substrate
Semiconductor Multi-Package Module Having Package Stacked Over Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Multichip Leadframe Package
Plastic Ball Grid Array Package with Integral Heatsink
Semiconductor Multi-Package Module Having Package Stacked Over Die-Up Flip Chip Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Method of Fabricating a Semiconductor Multi-Package Module Having Wire Bond Interconnect Between Stacked Packages
Method of Fabricating a Semiconductor Multipackage Module Including a Processor and Memory Package Assemblies
Wire Bond Interconnection
Semiconductor Multi-Package Module Having Package Stacked Over Die-Up Flip Chip Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Wire Bond Interconnection
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →