Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
View Patent ↗A semiconductor multi-package module having a second package stacked over a lower ball grid array first package, each package including a die attached to a substrate, in which the first and second package substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a ball grid array first package including a substrate and a die, affixing a second package including a substrate and a die onto an upper surface of the lower package, and forming z-interconnects between the first and lower substrates.
1. A method for making a multipackage module, comprising
providing a BGA first package comprising a first package substrate,
providing a second package comprising a second package smaller than the first package substrate,
stacking the second package over the first package, and
electrically interconnecting the first and second package at both sides thereof by wire bonds connecting the first and second substrates.
2. The method of claim 1 , said BGA first package being a molded package, the molding having a generally planar upper surface, wherein stacking the second package over the first package comprises applying an adhesive onto the molding upper surface and placing the second package onto the adhesive.
3. The method of claim 2 wherein the adhesive is a curable adhesive, and further comprising curing the adhesive.
4. The method of claim 1 wherein providing the BGA first package comprises providing an unsingulated strip of BGA packages.
5. The method of claim 1 where providing the BGA first package comprises testing BGA packages for a performance and reliability requirement and identifying the said first package as meeting the requirement.
6. The method of claim 1 where providing the second package comprises testing packages for a performance and reliability requirement and identifying the said second package as meeting the requirement.
7. The method of claim 1 , further comprising attaching second-level interconnect malls onto the BGA first package substrate.
8. The method of claim 1 , further comprising encapsulating the stacked packages in a multipackage module molding.
9. The method of claim 1 , further comprising singulating the modules.
10. The method of claim 1 wherein providing the second package comprises providing a land grid array package.
11. The method of claim 1 wherein providing the second package comprises providing a land grid array package, the land grid array package being at least partially molded.
12. The method of claim 11 , the land grid array package being fully molded.
13. The method of claim 11 , the wire bonds of the land grid array package being molded, and at least a portion of the upper surface of an upper die being exposed.
14. The method of claim 1 wherein the BGA first package is provided with an electromagnetic shield affixed over the die.
15. The method of claim 14 , the shield having a generally planar upper surface, wherein stacking the second package over the first package comprises applying an adhesive onto the shield upper surface and placing the second package onto the adhesive.
16. The method of claim 15 wherein the adhesive is a curable adhesive, and further comprising curing the adhesive.
17. The method of claim 1 , further comprising providing a heat spreader.
18. The method of claim 17 , wherein providing a heat spreader comprises carrying out a drop-in mold operation, the heat spreader being placed into a mold prior to forming a module molding.
19. The method of claim 17 , wherein providing a heat spreader comprises affixing a generally planar portion of a heat spreader onto a generally planar upper surface of the second package.