Patent Assignment
Reel/Frame 036286/0612
Merger and Change of Name
Recorded: 2015-08-06
Pages: 7
Assignee
STATS CHIPPAC, INC.
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Properties
(59)
Flip Chip-in-Leadframe Package and Process
A Method of Forming a Flip Chip Interconnection Structure
Plastic Ball Grid Array Package with Integral Heatsink
Self-Coplanarity Bumping Shape for Flip Chip
Apparatus and Process for Precise Encapsulation of Flip Chip Interconnnects
Plastic Semiconductor Package
Chip Scale Package with Flip Chip Interconnect
Tape Ball Grid Array Semiconductor Package Structure and Assembly Process
Method for Manufacturing Plastic Ball Grid Array with Integral Heatsink
Semiconductor Multipackage Module Including Processor and Memory Package Assemblies
Semiconductor Multi-Package Module Having Wire Bond Interconnect Between Stacked Packages
Semiconductor Multi-Package Module Including Stacked-Die Package and Having Wire Bond Interconnect Between Stacked Packages
Semiconductor Multi-Package Module Having Wire Bond Interconnect Between Stacked Packages and Having Electrical Shield
Semiconductor Multi-Package Module Having Package Stacked Over Die-Down Flip Chip Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Semiconductor Multi-Package Module Having Package Stacked Over Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Semiconductor Multi-Package Module Having Inverted Second Package Stacked Over Die-Up Flip-Chip Ball Grid Array (Bga) Package
Semiconductor Multi-Package Module Having Inverted Second Package and Including Additional Die or Stacked Package on Second Package
Semiconductor Multi-Package Module Having Inverted Bump Chip Carrier Second Package
Semiconductor Multi-Package Module Having Inverted Second Package Stacked Over Die-Up Flip-Chip Ball Grid Array (Bga) Package
Semiconductor Stacked Multi-Package Module Having Inverted Second Package and Electrically Shielded First Package
Flip Chip Interconnection Structure
Method and Apparatus for Flip Chip Attachment by Post Collapse Re-Melt and Re-Solidification of Bumps
Dbg System and Method with Adhesive Layer Severing
Wire Bond Capillary Tip
Semiconductor Chip Packaging Method with Individually Placed Film Adhesive Pieces
Bonding Tool for Mounting Semiconductor Chips
Flip Chip Interconnection Pad Layout
Bump-On-Lead Flip Chip Interconnection
Multiple chip package module having inverted package stacked over die
Die Attach by Temperature Gradient Lead Free Soft Solder Metal Sheet or Film
Semiconductor Multi-Package Module Having Inverted Second Package Stacked Over Die-Up Flip-Chip Ball Grid Array (Bga) Package
Adhesive/Spacer Island Structure for Stacking Over Wire Bonded Die
Method for Manufacturing Plastic Ball Grid Array Package with Integral Heatsink
Multichip Leadframe Package
Method for Reducing Semiconductor Die Warpage
Wire Bond Interconnection
Semiconductor Package Having Double Layer Leadframe
Chip Scale Package Having Flip Chip Interconnect on Die Paddle
Semiconductor Flip Chip Package Having Substantially Non-Collapsible Spacer
Semiconductor multi-package module having inverted second package stacked over die-down flip-chip ball grid array (BGA) package
Application:
11/337,168 →
Publication:
US 2006/0138649
Method for Making Semiconductor Multi-Package Module Having Inverted Second Package and Including Additional Die or Package Stacked on Second Package
Method for Making a Semiconductor Multi-Package Module Having Inverted Bump Chip Carrier Second Package
Method for Making a Semiconductor Multipackage Module Including a Processor and Memory Package Assemblies
Method of Fabricating a Semiconductor Multi-Package Module Having Inverted Second Package Stacked Over Die-Up Flip-Chip Ball Grid Array (Bga)
Method for Making a Semiconductor Multi-Package Module Having Wire Bond Interconnect Between Stacked Packages
Semiconductor Multi-Package Module Having Package Stacked Over Die-Down Flip Chip Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Adhesive/Spacer Island Structure for Multiple Die Package
Stacked Semiconductor Package Having Adhesive/Spacer Structure and Insulation
Method of Fabricating a Semiconductor Multi-Package Module Having a Second Package Substrate with an Exposed Metal Layer Wire Bonded to a First Package Substrate
Semiconductor Multi-Package Module Having Package Stacked Over Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Multichip Leadframe Package
Plastic Ball Grid Array Package with Integral Heatsink
Semiconductor Multi-Package Module Having Package Stacked Over Die-Up Flip Chip Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Method of Fabricating a Semiconductor Multi-Package Module Having Wire Bond Interconnect Between Stacked Packages
Method for Making a Semiconductor Multi-Package Module Having Inverted Wire Bond Carrier Second Package
Method of Fabricating a Semiconductor Multipackage Module Including a Processor and Memory Package Assemblies
Wire Bond Interconnection
Semiconductor Multi-Package Module Having Package Stacked Over Die-Up Flip Chip Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
Wire Bond Interconnection
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD
To: STATS CHIPPAC PTE. LTE
Reel/Frame 038378/0200 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Change of Name
Apr 11, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038401/0532 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →
Corrective Assignment to Correct the Correct the Spelling of Assignee's Name from "Stats Chippac Pte. Lte," to "Stats Chippac Pte. Ltd." Previously Recorded at Reel: 038401 Frame: 0532. Assignor(S) Hereby Confirms the Assignment.
Sep 1, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064803/0109 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →