Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package
View Patent ↗A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, and in which the upper and lower substrates are interconnected by wire bonding; and further in which at least one of the packages includes a stacked die package, or includes an additional stacked package. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, in which one or both of the upper and lower packages is a stacked die package or in which one of the packages includes an additional stacked package, and forming z-interconnects between the upper and lower substrates.
1. A method for making a multi-package module, comprising
providing a first package, the first package comprising at least one die mounted on a first side of a first package substrate,
providing a second package, the second package comprising at least one die mounted on a first side of a second package substrate,
inverting the second package and stacking the second package over the first package, and
forming electrical interconnects between the first package and the second package by wire bonding; and
mounting an additional die on a second side of the second package substrate.
2. The method of claim 1 wherein providing a first package comprises testing packages for a performance and reliability requirement, and identifying a package that meets the requirement as a said first package.
3. The method of claim 1 wherein providing a second package comprises testing packages for a performance and reliability requirement, and identifying a package that meets the requirement as a said second package.
4. The method of claim 1 wherein providing a first package comprises providing an unsingulated strip of stacked die packages.
5. The method of claim 1 wherein providing a first package comprises providing a package comprising a first die affixed to the first package substrate, a second die affixed over the first die, and wire bond interconnects between said first and second die and the first package substrate.
6. The method of claim 5 wherein providing a first package comprises providing a package further comprising a spacer interposed between said first and said second die.
7. The method of claim 1 , further comprising providing a heat spreader.
8. The method of claim 1 , further comprising attaching second-level interconnect balls onto a second side of the first package substrate.
9. The method of claim 1 , further comprising encapsulating the stacked packages and the additional die in a molding compound.
10. The method of claim 1 wherein mounting an additional die on a second side of the second package substrate comprises forming a flip chip interconnection between the additional die and the second package substrate.
11. The method of claim 1 wherein mounting an additional die on a second side of the second package substrate comprises affixing the additional die on the second side of the second package substrate and forming wire bond interconnects between the additional die and the second package substrate.
12. The method of claim 1 wherein the step of mounting the additional die on a second side of the second package substrate is carried out following the step of stacking the second package over the first package.
13. The method of claim 12 wherein the step of mounting the additional die on a second side of the second package substrate is carried out following the step of forming electrical interconnects between the first package and the second package.
14. The method of claim 1 wherein the step of mounting the additional die on a second side of the second package substrate is carried out prior to the step of stacking the second package over the first package.
15. The method of claim 1 wherein the step of mounting the additional die on a second side of the second package substrate is carried out prior to the step of inverting the second package over the first package.
16. A method for making a multi-package module, comprising
providing a first package, the first package comprising at least one die mounted on a first side of a first package substrate,
providing a second package, the second package comprising at least one die mounted on a first side of a second package substrate,
inverting the second package and stacking the second package over the first package, and
forming electrical interconnects between the first package and the second package by wire bonding; and
mounting an additional package on a second side of the second package substrate.
17. The method of claim 16 wherein providing an additional package comprises providing a ball grid array additional package, and wherein mounting an additional package on a second side of the second package substrate comprises forming a ball grid array interconnection between the ball grid array additional package and the second package substrate.
18. The method of claim 16 wherein providing an additional package comprises providing a land grid array additional package, and wherein mounting an additional package on a second side of the second package substrate comprises affixing the additional package on the second side of the second package substrate and forming wire bond interconnects between the additional package and the second package substrate.
19. The method of claim 16 wherein the step of mounting the additional package on a second side of the second package substrate is carried out following the step of stacking the second package over the first package.
20. The method of claim 19 wherein the step of mounting the additional package on a second side of the second package substrate is carried out following the step of forming electrical interconnects between the first package and the second package.
21. The method of claim 16 wherein the step of mounting the additional package on a second side of the second package substrate is carried out prior to the step of stacking the second package over the first package.
22. The method of claim 21 wherein the step of mounting the additional package on a second side of the second package substrate is carried out prior to the step of inverting the second package over the first package.
23. The method of claim 16 wherein providing a first package comprises testing packages for a performance and reliability requirement, and identifying a package that meets the requirement as a said first package.
24. The method of claim 16 wherein providing a second package comprises testing packages for a performance and reliability requirement, and identifying a package that meets the requirement as a said second package.
25. The method of claim 16 wherein providing an additional package comprises testing packages for a performance and reliability requirement, and identifying a package that meets the requirement as an additional package.
26. The method of claim 16 wherein providing a first package comprises providing an unsingulated strip of stacked die packages.
27. The method of claim 16 wherein providing a first package comprises providing a package comprising a first die affixed to the first package substrate, a second die affixed over the first die, and wire bond interconnects between said first and second die and the first package substrate.
28. The method of claim 27 wherein providing a first package comprises providing a package further comprising a spacer interposed between said first and said second die.
29. The method of claim 16 , further comprising encapsulating the first and second packages and the additional package in a molding compound.
30. The method of claim 16 , further comprising providing a heat spreader.
31. The method of claim 16 , further comprising attaching second-level interconnect balls onto a second side of the first package substrate.