Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, and in which the first and second substrates are interconnected by wire bonding, and in which the first package includes a flip-chip ball grid array package having a flip-chip in a die-down configuration. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a flip-chip in a die-down configuration, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
1 . A multi-package module comprising stacked first and second packages, each said package including a die attached to a substrate, wherein the second package is inverted and wherein the first and second substrates are interconnected by wire bonding, and wherein the first package comprises a flip-chip ball grid array package having a flip-chip in a die-down configuration.
2 . A method for making a multi-package module, comprising
providing a die-down flip chip first package including a first package substrate,
providing a second package including a die and a second package substrate,
inverting the second package and stacking the inverted second package over the first package, and
electrically interconnecting the first and second packages by wire bonds connecting the first package substrate and the second package substrate.
3 . A mobile communications device comprising a multi-package module according to claim 1 .
4 . A computer comprising a multi-package module according to claim 1.