Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate
View Patent ↗A semiconductor multi-package module has stacked first and second packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the first and second substrates are interconnected by wire bonding, and in which the first package includes a flip-chip ball grid array package having a flip-chip in a die-up configuration. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a flip-chip in a die-up configuration, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
1. A method for making a multi-package module, comprising:
providing a die-up flip chip first package including a first package substrate,
providing a second package including a die and a second package substrate, the second package substrate having a metal layer exposed at an edge thereof,
inverting the second package and stacking the inverted second package over the first package, and
electrically interconnecting the first and second packages by wire bonds connecting the first package substrate and the metal layer exposed at the edge of the second package substrate.
2. The method of claim 1 wherein providing a die-up flip chip first package comprises providing an unsingulated strip of die-up flip chip first packages.
3. The method of claim 2 , further comprising singulating the completed module from the strip.
4. The method of claim 1 wherein providing a die-up flip chip first package comprises testing die-up flip chip packages for a performance and reliability requirement, and selecting a package meeting the said requirement as a said first package.
5. The method of claim 4 , further comprising providing the first package with an electromagnetic shield.
6. The method of claim 1 wherein providing a second package comprises testing packages for a performance and reliability requirement, and selecting a package meeting the said requirement as a said second package.
7. The method of claim 1 wherein providing a second package comprises providing a land grid array package.
8. The method of claim 1 wherein providing a second package comprises providing a bump chip carrier package.
9. The method of claim 1 wherein stacking the second package over the first package comprises affixing the inverted second package onto a surface of the first package substrate.
10. The method of claim 9 wherein affixing the second package onto a surface of the first package substrate comprises applying an adhesive onto a die attach area of the first package surface substrate and contacting the inverted second package with the adhesive.
11. The method of claim 10 wherein applying the adhesive comprises applying a curable adhesive, and further comprising curing the adhesive.
12. The method of claim 1 , further comprising attaching second-level interconnect balls onto the first substrate.
13. The method of claim 1 , further comprising encapsulating features over the first substrate with a molding compound.
14. The method of claim 1 , further comprising providing the module with a heat spreader.
15. The method of claim 14 wherein providing the module with a heat spreader comprises performing a drop-in molding operation.
16. The method of claim 14 wherein providing the module with a heat spreader comprises affixing a generally planar heat spreader onto an upward facing surface of the inverted second package.