Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
View Patent ↗A semiconductor multi-package module having stacked second and first packages, each package including a die attached to a substrate, in which the first and second package substrates are interconnected by wire bonding, and in which the first package is a flip chip ball grid array package in a die-down configuration. Also, a method for making a semiconductor multi-package module, by providing a first package including a first package substrate and having a die-down flip chip configuration, affixing a second package including a second package substrate an upper surface of the first package, and forming z-interconnects between the first and second package substrates.
1. A multi-package module comprising stacked first and second packages, the first package including a die attached to and electrically connected to a first substrate, and the second package including a die attached to and electrically connected to a second substrate, wherein the first and second substrates are interconnected by wire bonding, wherein the first package comprises a flip-chip ball grid array package having a flip-chip in a die-down configuration, and wherein the second package is encapsulated with a package encapsulation, the module further comprising second-level interconnections solder ball pads at the lower side of the lower package substrate.
2. The multi-package module of claim 1 wherein the second package is a wire bonded land grid array package.
3. The multi-package module of claim 2 wherein the die and wire bonds in the second package are fully encapsulated with a molding material.
4. The multi-package module of claim 2 wherein the second package is peripherally encapsulated to an extent sufficient to cover the wire bonds between the die and the substrate.
5. The multi-package module of claim 2 wherein the second package substrate is a single-metal layer substrate.
6. The multi-package module of claim 1 wherein the electrical shield is configured to serve as a heat spreader.
7. The multi-package module of claim 1 wherein the flip chip package includes an RF die.
8. The multi-package module of claim 1 wherein the flip chip package includes an RF die, and the shield serves to limit electromagnetic interference between the RF die and other die in the multi-package module.
9. The multi-package module of claim 1 wherein the first package is provided with an electrical shield.
10. The multi-package module of claim 1 wherein the second package is a stacked die package.
11. The multi-package module of claim 10 wherein adjacent stacked die in the stacked die package are separated by spacers.
12. The multi-package module of claim 1 wherein the second package is stacked over the first package, and wherein the flip-chip die on the first package is provided with an electrical shield.
13. The multi-package module of claim 1 wherein the first package substrate includes an embedded ground plane.
14. The multi-package module of claim 13 , the ground plane being configured to serve for heat dissipation.
15. The multi-package module of claim 13 , the ground plane being configured to serve as an electrical shield.
16. The multi-package module of claim 1 wherein at least one of the first and the second package is a stacked-die package.
17. The multi-package module of claim 1 wherein the second package is a stacked-die package.
18. The multi-package module of claim 1 , further comprising a heat shield.
19. A mobile communications device comprising a multi-package module according to claim 1 .
20. A computer comprising a multi-package module according to claim 1 .