Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
View Patent ↗A semiconductor multi-package module has stacked first and second packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the first and second substrates are interconnected by wire bonding, and in which the first package includes a flip-chip ball grid array package having a flip-chip in a die-up configuration. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a flip-chip in a die-up configuration, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
1. A multi-package module comprising stacked first and second packages, each said package including a die attached to a substrate, wherein the substrate comprises a dielectric layer and a patterned metal layer wherein the second package is inverted, wherein the first and second substrates are interconnected by wire bonding, and wherein the first package comprises a flip-chip ball grid array package having a flip-chip in a die-up configuration.
2. The multi-package module of claim 1 wherein the inverted second package is a wire bonded land grid array package.
3. The multi-package module of claim 2 wherein the die and wire bonds in the inverted second package are at least partially encapsulated with a molding material.
4. The multi-package module of claim 2 wherein the die and wire bonds in the inverted second package are fully encapsulated with a molding material.
5. The multi-package module of claim 2 wherein the second package substrate is a single-metal layer substrate.
6. The multi-package module of claim 2 wherein the second package substrate is a bump chip carrier type package substrate.
7. The multi-package module of claim 1 wherein the flip chip package is provided with an electrical shield.
8. The multi-package module of claim 7 wherein the electrical shield is configured to serve as a heat spreader.
9. The multi-package module of claim 7 wherein the flip chip package includes an RF die, and the shield serves to limit electromagnetic interference between the RF die and other die in the multi-package module.
10. The multi-package module of claim 1 wherein the flip chip package includes an RF die.
11. The multi-package module of claim 1 wherein the first package is provided with an electrical shield.
12. The multi-package module of claim 1 wherein the inverted second package is a stacked die package.
13. The multi-package module of claim 12 wherein adjacent stacked die in the stacked die package are separated by spacers.
14. The multi-package module of claim 1 wherein the second package is stacked over the first package, and wherein the flip-chip die on the first package is provided with an electrical shield.
15. The multi-package module of claim 1 wherein the first package substrate includes an embedded ground plane.
16. The multi-package module of claim 15 , the ground plane being configured to serve for heat dissipation.
17. The multi-package module of claim 15 , the ground plane being configured to serve as an electrical shield.
18. The multi-package module of claim 1 wherein at least one of the first and the inverted second package is a stacked-die package.
19. The multi-package module of claim 1 wherein the inverted second package is a stacked-die package.
20. The multi-package module of claim 1 , further comprising a heat shield.
21. A mobile communications device comprising a multi-package module according to claim 1 , wherein the multi-package module is electrically connected to underlying circuitry in the mobile communications device.
22. A computer comprising a multi-package module according to claim 1 , wherein the multi-package module is electrically connected to underlying circuitry in the computer.