Semiconductor multi-package module having inverted bump chip carrier second package
View Patent ↗A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the upper and lower substrates are interconnected by wire bonding, and in which the inverted second package comprises a bump chip carrier package. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper bump chip carrier package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
1. A multi-package module comprising stacked lower and upper packages, each said package including a die attached to a substrate, wherein the upper package is inverted, wherein the upper and lower substrates are interconnected by wire bonding, and wherein the inverted upper package comprises a bump chip carrier package.
2. The multi-package module of claim 1 wherein the lower package comprises a bull grid array package.
3. The multi-package module of claim 1 wherein the lower package comprises a die-down flip chip package.
4. The multi-package module of claim 1 wherein the lower package comprises a die-up flip chip package.
5. The multi-package module of claim 1 wherein the inverted upper package includes an additional die stacked on the bump chip carrier package.
6. The multi-package module of claim 1 wherein the inverted upper package comprises a stacked die package.
7. The multi-package module of claim 6 wherein at least two adjacent stacked die in the upper package are separated by a spacer.
8. The multi-package module of claim 6 wherein the die affixed to the inverted upper package substrate is electrically connected to the upper package substrate by wire bonding.
9. The multi-package module of claim 6 wherein a plurality of the stacked die in the inverted upper package are electrically connected to the upper package substrate by wire bonding.
10. The multi-package module of claim 1 , further comprising a heat spreader over the inverted upper package.
11. A mobile device comprising the multi-package module of claim 1 .
12. A computer comprising the multi-package module at claim 1 .
13. The multi-package module of claim 1 wherein the upper package die is electrically connected to the upper package substrate by wire bonding.
14. The multi-package module of claim 1 wherein the lower package comprises a bump chip carrier package.