Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
View Patent ↗A semiconductor multi-package module having stacked second and first packages, each package including a die attached to a substrate, in which the first and second package substrates are interconnected by wire bonding, and in which the first package is a flip chip ball grid array package in a die-down configuration. Also, a method for making a semiconductor multi-package module, by providing a first package including a first package substrate and having a die-down flip chip configuration, affixing a second package including a second package substrate an upper surface of the first package, and forming z-interconnects between the first and second package substrates.
1. A method for making a multi-package module, comprising:
providing a first package including a die-down flip chip and a first package substrate,
providing a second package including a wire bonded die, at least as large as the die-down flip chip, electrically connected at two sides to a second package substrate in which the wire bonded die is enclosed in a first encapsulant,
stacking the second package over the first package,
electrically interconnecting the first and second packages by wire bonds connecting the first package substrate and the second package substrate at two sides, and
molding a second encapsulant to enclose the second package, including the first encapsulant, and the wire bonds.
2. The method of claim 1 wherein providing a die-down flip chip first package comprises providing an unsingulated strip of die-down flip chip first packages.
3. The method of claim 2 , further comprising singulating the completed module from the strip.
4. The method of claim 1 wherein providing a die-down flip chip first package comprises testing die-down flip chip packages for a performance and reliability requirement, and selecting a package meeting said requirement as said first package.
5. The method of claim 1 wherein providing a second package comprises testing packages for a performance and reliability requirement, and selecting a package meeting said requirement as said second package.
6. The method of claim 1 wherein providing a second package comprises providing a land grid array package.
7. The method of claim 1 wherein stacking the second package over the first package comprises affixing the second package onto an upper surface of the die-down flip chip die.
8. The method of claims 7 wherein affixing the second package onto an upper surface of the die-down flip chip die comprises applying an adhesive onto the upper surface of the die and contacting the second package with the adhesive.
9. The method of claim 8 wherein applying the adhesive comprises applying a curable adhesive, and further comprising curing the adhesive.
10. The method of claim 1 , further comprising attaching second-level interconnect balls onto the first substrate.
11. The method of claim 1 , wherein molding the second encapsulant to enclose the second package includes encapsulating features over the first substrate with a molding compound.
12. The method of claim 1 , further comprising providing the first package with an electromagnetic shield.
13. The method of claim 12 wherein providing the first package with an electromagnetic shield comprises affixing a shield over the die-down flip chip die.
14. The method of claim 13 wherein stacking the second package over the first package comprises affixing the second package onto an upper surface of the shield.
15. The method of claim 14 wherein affixing the second package onto an upper surface of the shield comprises applying an adhesive onto the upper surface of the shield and contacting the second package with the adhesive.
16. The method of claim 15 wherein applying the adhesive comprises applying a curable adhesive, and further comprising curing the adhesive.
17. The method of claim 1 , further comprising providing the module with a heat spreader.
18. The method of claim 17 wherein providing the module with a heat spreader comprises performing a drop-in molding operation.
19. The method of claim 17 wherein providing the module with a heat spreader comprises affixing a generally planar heat spreader onto an upper surface of the second package.