Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
View Patent ↗A semiconductor multi-package module having a second package stacked over a lower ball grid array first package, each package including a die attached to a substrate, in which the first and second package substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a ball grid array first package including a substrate and a die, affixing a second package including a substrate and a die onto an upper surface of the lower package, and forming z-interconnects between the first and lower substrates.
1. A multipackage module having a second package stacked over a first package, each said package comprising a die attached to a first side of a substrate, the second package substrate and the first package substrate being interconnected by wire bonds connecting interconnect pads near at least two opposite edges of the second package substrate with pads at the first side of the first package substrate, wherein the first package further comprises solder balls connected to bonding pads at a second side of the first package substrate.
2. The multipackage module of claim 1 wherein at least one said package has wire bond interconnect of the die with the substrate, and the said wire bonded package is at least partly encapsulated.
3. The multipackage module of claim 1 wherein the second package has wire bond interconnect of the die with the substrate.
4. The multipackage module of claim 3 wherein the second package is fully encapsulated.
5. The multipackage module of claim 3 wherein the second package is encapsulated to an extent sufficient to protect wire bonds between the die and the substrate.
6. The multipackage module of claim 1 wherein the second package is a land grid array package.
7. The multipackage module of claim 6 wherein the land grid array package substrate is a single-metal layer substrate.
8. The multipackage module of claim 1 , further comprising a heat spreader having a generally planar upper surface exposed at the top of the module.
9. The multipackage module of claim 8 wherein a planar part of the heat spreader is supported by support members over the first package substrate.
10. The multipackage module of claim 8 wherein a planar part of the heat spreader is affixed onto an upper surface of the second package.
11. The multipackage module of claim 1 , further comprising an electromagnetic shield for at least one of the packages.
12. The multipackage module of claim 1 , further comprising an electromagnetic shield for the first package.
13. The multipackage module of claim 12 wherein the second package is affixed onto an upper surface of the electromagnetic shield.