Tape ball grid array semiconductor package structure and assembly process

Inventors: Marcos Karnezos, Yong-Bae Kim

Provisional Application Expired

	Code	Description	Pages	PDF
2001-02-27	`TRNA`	Transmittal of New Application	1	View
2001-02-27	`SPEC`	Specification	6	View
2001-02-27	`DRW`	Drawings-only black and white line drawings	5	View

Inventors

Marcos Karnezos Palo Alto, CA

Yong-Bae Kim Seoul, KOREA, REPUBLIC OF

Attorneys & Agents of Record

KORBIN VAN DYKE Reg. 52313 Agent

ANDREW DUNLAP Reg. 60554 Attorney · WENDEROTH, LIND & PONACK, L.L.P.

HANNAH POWELL Reg. 84418 Agent · HAYNES BEFFEL & WOLFELD LLP

MARK HAYNES Reg. 30846 Attorney · HAYNES BEFFEL & WOLFELD LLP

FRANKLIN SCHELLENBERG Reg. 47315 Agent

WARREN WOLFELD Reg. 31454 Attorney · HAYNES BEFFEL & WOLFELD LLP

ERNEST BEFFEL Reg. 43489 Attorney · HAYNES BEFFEL & WOLFELD, LLP

JASON LIAO Reg. 59382 Agent

PAUL DURDIK Reg. 37819 Attorney · HAYNES BEFFEL AND WOLFELD LLP

Prosecution

No recorded assignments were found for this patent.

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