Patent Assignment
Reel/Frame 012889/0737
Assignment of Assignor's Interest
Recorded: 2002-05-09
Pages: 2
Assignor
OHMIYA CORPORATION
Executed: 2002-04-23
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
CHIYODA-KU, 2-3, MARUNOUCHI 2-CHOME, TOKYO 100-8310, JAPAN
Covered Property
(1)
Heat-Treatment Apparatus, Heat-Treatment Method Using the Same and Method of Producing a Semiconductor Device
Application:
09/983,391 →
Publication:
US 2002/0121242
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 24, 2001
From: MINAMI, MASASHI; KATSURADA, IKUO
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 012285/0643 →
Corrective Assignment to Add Assignee Name, Filed on 10/24/01, Recorded on Reel 012285 Frame 0643. Assignor Hereby Confirms the Assignment of Assignor's Interest.
Mar 21, 2002
From: MINAMI, MASASHI; KATSURADA, IKUO
To: MITSUBISHI DENKI KABUSHIKI KAISHA; OHMIYA CORPORATION
Reel/Frame 012708/0113 →
Assignment of Assignor's Interest
Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest
Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →