Patent Assignment
Reel/Frame 012914/0742
Assignment of Assignor's Interest
Recorded: 2002-05-16
Pages: 3
Assignee
INCEP TECHNOLOGIES, INC.
10650 TREENA STREET, SUITE 308, SAN DIEGO, CALIFORNIA, 92131
Covered Property
(1)
Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrate
Application:
10/147,395 →
Publication:
US 2002/0151195